The difference between active solder wire and ordinary solder wire
2019-08-14
Solder wire is a common solder material in the electronics industry. We use it together with soldering iron when soldering electronic components. There are many kinds of solder wire. One of them is called active solder wire. We don't know about active solder wire. Today, the technical staff of Shenzhen Xinghongtai manufacturer introduced the difference between active solder wire and ordinary solder wire:
First understand what is active solder wire:
Active solder wire refers to a solder wire to which an active agent is added, which is advantageous for soldering. The active agent in the active solder wire is to improve the auxiliary heat conduction of the solder wire in the welding process, remove the oxidation, reduce the surface tension of the material to be welded, remove the oil stain on the surface of the welded material, and increase the welding area. The characteristic of the active solder wire is a tin alloy wire having a certain length and diameter, which can be used in combination with the soldering iron in the soldering of the electronic original device.
The difference between active solder wire and ordinary solder wire
There is no essential difference between the active solder wire and the ordinary solder wire. The active solder wire is added with an active agent, which is beneficial for soldering; generally, the common solder wire has an active agent added thereto. Ordinary solder wire is an alloy of tin and lead. The tin content is high, the melting point of the solder is low, and the fluidity is good. Welding general electrical products have no requirements for tin wire, as long as the welding operation is good, the quality of welding is high.
The formula of the active core solder wire enables the solder wire to improve the expansion rate while being qualified, the fragrance during soldering, the solder joints are full and matte, the flux residue is non-corrosive, and the insulation resistance is high. The composition and weight percentage of the present invention are: Solder 97-99, flux 1-3, wherein the composition and weight percentage of flux are: special grade rosin 50-95, modified rosin 5-50, antioxidant 0.1-5, organic nitrogen compound hydrohalide 0.1-5, Fatty acid 0.2-5.
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